In-Situ Particle Monitoring (ISPM)
Particle contamination is a pervasive problem, especially in wafer processing applications such as LPCVD, etch, and PVD. Our engineering services team can install an ISPM solution, establish criteria for graduated alarming capability, implement data acquisition schemes, and provide data analysis and interpretation consulting. The result is immediate detection of contamination problems rather than relying on post-process measurements to determine that contamination is a problem. The value to our customers is increased yield and tool productivity, plus a reduction in scrapped wafers.

End Point Detection Integration
Identifying end-of-process for etch and CMP applications is critical to avoiding under- or over-processing situations. Whether your end point sensor has been developed internally or purchased from a third party, it is essential that the sensor operate in concert with the tool, MES, SPC and APC systems. Our Microelectronics Engineering Services team can ensure that the systems exactly match. We have undertaken complete engineered integration projects on dozens of end point solutions utilizing several end point suppliers on Etch and CMP tools from the world’s largest OEMs.